Process Engineer

Overview

In this role you will own the end-to-end packaging and assembly system, shaping strategy and delivering hands-on improvements from NPI to high-volume production. You will architect scalable packaging solutions for RF products and lead cross-functional initiatives to meet defence and telecom growth needs. Expect a mix of hands-on on-floor optimization and strategic technology direction with a focus on reliability and process discipline. This is a fast-paced, high-technology environment where your work directly enables scalable, robust manufacturing capabilities.

Responsibilities

• Define and implement end-to-end packaging and assembly system aligned with RF product roadmap
• Establish standardized flows for die prep, die attach, wire bonding, encapsulation/moulding, dicing, QFN assembly, inspection and SMT integration
• Lead pre-NPI technology development and transition to volume production
• Provide hands-on technical leadership on RF/high-frequency packaging integration
• Develop equipment, capital and supplier strategies; govern compliance and reliability

Key requirements

• University degree or equivalent with focus on materials, mechanical or electronics engineering
• Proven experience taking packaging and assembly processes from R&D to volume production
• Strong problem-solving using DMAIC and 8D methodologies
• Experience with SPC, Cp/Cpk, and DoE
• Knowledge of MIL-STD-883 and IPC 600/610/7711
• Experience in QFN, plastic encapsulation/moulding, die attach and wire bonding

• Data-driven and analytical
• Strong communication and cross-functional collaboration
• Strategic thinker with hands-on capability
• QFN packaging
• Plastic encapsulation and moulding
• Die attach and wire bonding

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