Overview
In this role you will design complex high-speed hardware for advanced communication systems, translating architectural requirements into validated ASIC-ready designs. You will work on evaluation boards and PDN/SI challenges, collaborating with PCB teams to ensure robust bring-up and validation. This position offers the chance to influence high-speed architectures and contribute to reliable, scalable hardware for cutting-edge technology. The role combines hands-on design with verification and documentation to support production ramp-up and ASIC validation.
Responsibilities
- Develop hardware architectures from system requirements to detailed designs
- Create EVBs for ASIC validation, characterization and system integration
- Design high-speed clocking, power delivery and PDN architectures
- Perform Power Integrity (PI) and Signal Integrity (SI) analyses
- Develop schematics and define PCB stack-up, HDI and multilayer requirements
- Collaborate with PCB layout teams and review schematic, placement and routing
- Support board bring-up, debugging, validation and characterization
- Develop test plans and technical documentation
- Support DFM/DFT reviews and production ramp-up
Key requirements
- Bachelor’s or Master’s degree in Electrical/Electronics Engineering or related field
- 8+ years’ hardware design experience in complex electronic systems
- Experience from architecture/schematic to board bring-up and ASIC validation
- Strong experience with high-speed SerDes (26.4Gbps+), power delivery and PDN optimization
- Strong SI, PI and IR drop analysis understanding
- Experience with high-layer-count PCB, HDI and high-speed design
- Cadence OrCAD Capture, Allegro or equivalent proficiency
- Experience with MCU/microprocessor hardware and interfaces (DDR, Ethernet, SPI, I2C, UART, SDIO)
- High-frequency RF design experience (10GHz+ desirable)
- Hands-on use of oscilloscopes, spectrum analysers, VNAs and power analysers
- Strong troubleshooting and root-cause analysis skills
- Experience with mixed-signal design, manufacturing, reliability testing or ASIC development (advantageous)
- Troubleshooting and root-cause analysis
- SerDes design (26.4Gbps+)
- Power delivery and PDN optimization
- PI/SI analysis
- HDI and multilayer PCB design
- Schematic capture and PCB tooling (Cadence OrCAD Capture, Allegro)
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