Global Manufacturing Technology Engineer

Company: ZF Friedrichshafen
Apply for the Global Manufacturing Technology Engineer
Location: Solihull
Job Description:

Overview

As Global Manufacturing Technology Engineer, you will develop and implement the electronics manufacturing technology roadmap to enable reliable, high-quality Automotive electronics. You collaborate with Electronics Hardware Engineering, PCB Design, AME and Manufacturing to industrialise new technologies and resolve production issues. You qualify processes and set engineering standards, including DFM guidelines and PCB design rule reviews. This role blends hands-on technical work with cross-functional coordination across global teams to drive scalable, robust manufacturing solutions.

Pay / Benefits

  • Competitive compensation
  • Pension System
  • 2x Life Assurance cover
  • Health Cashplan

Responsibilities

  • Develop and implement the Electronics Manufacturing Technology roadmap aligned with core and customer programmes
  • Qualify and industrialise electronics assembly and interconnection technologies (solder paste, conformal coating, underfill, edge bonding, corner bonding, press-fit pins)
  • Coordinate qualification testing of new electronics manufacturing technologies before first use in products
  • Develop and implement technology, process and engineering standards
  • Develop PCB Design for Manufacturing (DFM) guidelines and perform PCB design rule compliance reviews
  • Provide day-to-day technical support to Electronics Hardware Engineering teams and help solve industrialisation issues
  • Act as a technical bridge between Product Engineering and Manufacturing teams at production plants

Key requirements

  • Bachelor’s degree in Electronics Engineering, Electrical Engineering, Manufacturing Engineering or equivalent industry experience
  • Strong experience in electronics manufacturing, PCBA assembly and industrialisation
  • Knowledge of electronics assembly and interconnection technologies (soldering, conformal coating, underfill, edge bonding, press-fit)
  • Experience in technology qualification, process development, reliability testing and engineering standards; good understanding of PCB design and DFM principles
  • Experience working with cross-functional teams including Hardware Engineering, Mechanical Engineering, PCB Design, Manufacturing and technology suppliers
  • Strong problem-solving skills with ability to identify root causes and develop practical solutions; good communication across functions and locations
  • Self-motivated and proactive with ability to manage multiple projects across a global R&D environment; willingness to travel to suppliers and sites
  • Cross-functional collaboration
  • strong communication
  • problem-solving
  • Soldering
  • Conformal coating
  • Underfill

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Posted: October 1st, 2026