Principal Packaging Architect: 2.5D/3D & Chiplet Leadership

IC Resources is seeking a Principal Packaging Engineer to lead and define strategies for advanced 2.5D/3D packaging, heterogeneous integration and next-generation semiconductor systems across AI, HPC, RF, power and photonics. You will provide technical leadership, drive packaging roadmaps and oversee prototyping, qualification and collaboration with customers and partners.

The role requires a strong technical background and proven leadership experience to advance concepts from requirements to

#J-18808-Ljbffr…