Shift Process Integration Engineer ( 4 days on, 4 days off)

Overview

As a Shift Process Integration Engineer, you translate device designs into manufacturable InP-based semiconductor chips and support wafer fabrication processes. You’ll work with cross-functional teams to tackle technical challenges with commercial impact, on a 4-on/4-off site rotation at Caswell. The role focuses on integrating and optimising processes, ensuring scalable high-volume production for photonic devices. You will contribute to the development of lasers, modulators, receivers, and PICs for cloud and networking applications, linking R&D with manufacturing to drive yield and cost improvements.

Responsibilities

• Integrate wafer fabrication processes to deliver InP-based products including coherent and direct-detection components
• Optimize existing wafer fab processes to improve yield, cost, and cycle time
• Develop and maintain process flows and MES documentation
• Monitor and evaluate product performance throughout development
• Use SEM and other tools to investigate and improve process performance
• Develop new process modules and ensure scalability for high-volume manufacturing
• Support transfer of new processes and products into production
• Apply Six Sigma methodologies for process and product improvement
• Present process data and analyses to support manufacturability decisions
• Act as interface between design, operations engineering, and manufacturing
• Serve as process expert for products, including post-transfer support

Key requirements

• Degree in Physics, Physical Chemistry, Materials Science, or related field
• Hands-on semiconductor wafer processing experience, preferably in III-V materials
• Experience or knowledge in: epitaxy, lithography, wet/dry etching, dielectric and metal deposition, ion implantation and diffusion
• Experience in process integration and development of process flows
• Strong problem-solving skills and ability to manage complex engineering activities

• Strong analytical and scientific reasoning
• Effective team collaboration and organizational abilities
• Excellent written and verbal communication
• Epitaxy
• Lithography
• Wet and dry etching

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