Lead Semiconductor Packaging Engineer

Nexperia in the United Kingdom is seeking a Principal Package Competence Engineer to drive advanced packaging for Power MOSFETs. You will lead design studies and serve as a recognised expert, shaping technology roadmaps and collaborating with product lines, assembly sites and R&D teams.

The role demands a PhD with 5+ years in packaging, plus experience in DOE, simulation, and failure analysis, with a proven record of innovation. Hybrid work, competitive pay, and global impact await.

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