Process Engineer

Overview

In this role you will develop, optimize and control manufacturing processes for microwave, millimetre-wave and RF module production. You will work hands-on to transfer new technologies from development into stable, repeatable production, with a strong focus on die attach and bonding processes. You will collaborate with RF engineering, quality, operations and manufacturing teams to improve yield, robustness and cost efficiency while supporting NPI and future technology roadmap activity. This is a hands-on, high-precision environment offering a key role in scaling advanced RF packaging capabilities.

Responsibilities

• Develop, optimize and control manufacturing processes for RF module production
• Transfer technologies from development to production and ensure stable, repeatable processes
• Improve process robustness, yield, manufacturability and cost efficiency
• Support NPI and technology roadmap activities
• Collaborate with RF engineering, quality, operations and manufacturing teams
• Investigate process issues affecting voiding, bond line thickness, shear strength and pad damage
• Contribute to process validation, qualification plans, control plans, and SOPs
• Maintain manufacturing process documentation and ensure compliance with standards

Key requirements

• Experience as a Process Engineer in semiconductor/RF module assembly/high-precision electronics manufacturing
• Practical experience with die attach processes (silver epoxy, silver sintering, eutectic attach)
• Exposure to gold wire bonding, ribbon bonding, ball bonding or wedge bonding
• Strong understanding of process windows (temperature, pressure, time, atmosphere) and impact on yield/reliability
• Experience with process validation, qualification plans, control plans, SOPs
• Ability to investigate issues related to voiding, bond line thickness, shear strength, bond integrity, thermal resistance or pad damage
• Familiarity with yield improvement, root cause analysis and structured problem-solving methods (8D, DMAIC or FMEA)
• Degree in engineering, materials science, physics or related technical discipline
• RF packaging knowledge, SPC, Cp/Cpk, JEDEC standards useful but not essential

• Cross-functional collaboration
• Strong problem-solving orientation
• Hands-on, detail-oriented
• Die attach processes (silver epoxy, silver sintering, eutectic)
• Gold wire and ribbon bonding, ball/wedge bonding
• Process windows analysis (temperature, pressure, time, atmosphere)

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