Overview
In this role you will lead engineering projects for a global leader in semiconductor machinery. You’ll work across cross-functional teams to deliver NPIs on time, to quality and cost targets. You’ll partner with customers and drive technical direction, combining manufacturing know-how with software and hardware expertise. The role offers hybrid work, strong training, and clear career progression in a high-impact environment.
Pay / Benefits
- hybrid working
- company bonus
Responsibilities
- Create project plans and present reviews to customers
- Provide technical leadership to cross-functional teams (hardware, software, mechanical)
- Manage NPI development and ensure on-time delivery within quality and cost targets
- Support experience with electronic assembly techniques
- Utilize advanced Microsoft Office tools
- Apply Waterfall and Scrum methodologies to projects
Key requirements
- Strong track record delivering engineering projects
- Manufacturing background in mechanical or electronic domains
- Self-motivated, enthusiastic, technically excellent, business-savvy, strong communicator
- Experience with electronic assembly techniques
- Advanced MS Office skills
- PM experience with Waterfall and Scrum
- Strong communication
- Self-motivation
- Business acumen
- Electronic assembly techniques
- Waterfall project management
- Scrum/agile practices
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