Principal High-Speed Digital Electronics Design Engineer

Company: Leonardo DRS
Apply for the Principal High-Speed Digital Electronics Design Engineer
Location: Edinburgh
Job Description:

Overview

In this role you will lead high-speed digital hardware development for the GCAP radar sensor, contributing to the full engineering lifecycle within a multi-disciplinary team. You will design advanced PCBs, implement FPGA and microprocessor solutions, and help deliver a complex system from requirements to customer acceptance. Your work will be documented and controlled, ensuring robust integration with target platforms. This is a growth phase for GCAP, offering impact across system-level hardware design and integration, with a clear focus on secure, mission-critical delivery.

Pay / Benefits

  • company-funded benefits package
  • up to 12 flexi-days per year
  • up to 15% employer pension contribution
  • mental health support
  • financial advice and employee networks for inclusion and wellbeing
  • free access to 4,000+ online courses via Coursera and LinkedIn Learning

Responsibilities

  • Design high-speed digital PCBs leveraging FPGA, microprocessor, and interconnect technologies
  • Support full hardware lifecycle from requirements analysis through design, unit test, integration, and acceptance test
  • Document work products and manage configurations with plans and progress reports
  • Collaborate in a multi-disciplinary team to solve real integration problems on complex systems

Key requirements

  • Bachelor in Electrical & Electronic Engineering (or related science)
  • Schematic capture experience
  • Design of high-speed serial links and knowledge of related protocols
  • Hands-on hardware, firmware & software integration of microprocessor-based designs
  • Methodical approach to hardware design lifecycle and structured processes
  • Debugging, testing, and verification of new designs for commissioning and integration
  • Security clearance or eligibility (BPSS; NSV may apply)
  • Methodical and structured thinking
  • Strong teamwork and problem-solving in cross-functional teams
  • Good documentation discipline and communication
  • High-speed digital PCB design
  • FPGA and microprocessor integration
  • High-speed serial communication links and protocols

…

Posted: September 30th, 2026