Application Engineer (AI/Hot swap)

Company: Nexperia
Apply for the Application Engineer (AI/Hot swap)
Location: Manchester
Job Description:

Overview

In this role, you will help develop high-reliability power protection for AI and data centre racks, focusing on 48V distribution architectures. You’ll work with the data centre team to enable hyperscale computing opportunities and define product specs from customer input. You’ll design and validate hot-swap and eFuse solutions, perform MOSFET SOA/thermal validation, and create reference models and literature. This position combines hands-on engineering with technical support to global sales, contributing to a leading semiconductor business shaping electrification and reliability at scale.

Pay / Benefits

  • Starting salary 55,000-65,000 DOE
  • Bonus up to 10% (stretch up to 20%)
  • Pension scheme up to 9%
  • EV salary sacrifice scheme
  • 12 x salary life assurance
  • Healthcare and wellbeing benefits

Responsibilities

  • Design, debug, and validate hot-swap protection and eFuse implementations for high-density rack systems
  • Perform MOSFET Safe Operating Area (SOA) characterization and thermal validation
  • Create technical literature, demo boards, and reference models for 48V power distribution systems
  • Define new product specifications based on customer inputs and market trends
  • Provide expert technical support to global sales teams and customers on power delivery challenges

Key requirements

  • Degree or equivalent in Electronics Engineering, Physics, or a relevant discipline
  • Passion for AI infrastructure or Data Centre power systems
  • Proven expertise in circuit simulation (e.g. SIMPLIS, LTspice, PSpice) and PCB design
  • Willingness to travel globally, occasionally on short notice, without visa processing delays
  • Communication with cross-functional teams
  • Customer-focused problem solving
  • Team collaboration
  • Power electronics: 48V distribution, OR-ing FETs, Hot-Swap controllers, high-current MOSFET switching
  • Server Power Supplies (CRPS), AI accelerators, high-reliability rack protection
  • Advanced Simulation: FEA, SPICE modelling (device level), and thermal analysis

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Posted: September 30th, 2026