Staff Package Design Engineer

Overview

In this role you will design advanced packaging for high-performance devices, collaborating with cross-functional teams to meet electrical, thermal, and mechanical targets. You will drive packaging solutions from QFN to WLCSP and flip-chip, ensuring manufacturability and reliability. You’ll work with customers and internal groups to optimize die-to-PCB interfaces and advance automation in the design flow. This position offers impact in product performance and manufacturing-ready packaging at Cirrus Logic.

Responsibilities

• Collaborate with cross-functional teams to meet performance, reliability, and manufacturability requirements
• Define package requirements with Design and layout teams (electrical, thermal, mechanical)
• Utilize AutoCAD, GDS tools, Siemens Fast3D and Cadence SiP Layout for physical design, electrical simulation and manufacturing validation
• Drive continuous improvement to ensure interface accuracy between package, die, and PCB
• Establish design rules for WLCSP, wire bond, and other packages with Customer, Designers, OSATs
• Understand DFM checks to improve assembly yield and prevent manufacturing issues
• Grow and promote automation in the package design flow
• Develop test vehicles to assess bump placement, PCB proximity effects, WLCSP stack-up on chip performance
• Collaborate with customers to resolve design issues between parts and PCB

Key requirements

• BS or above in Mechanical, Electrical, Chemical, or Materials Engineering
• Demonstrable packaging-related experience
• Experienced Cadence SiP layout user
• Strong AutoCAD user
• Knowledge of packaging technologies, materials, substrate design and assembly rules
• Understanding of electrical simulation results in package design
• Familiarity or willingness to learn Cadence Virtuoso on Unix
• Strong written and verbal communication; ability to present to customers and management
• Self-starter with ownership and accountability
• Ability to build influential relationships in a diverse environment

• strong communication
• ownership and accountability
• collaboration in cross-functional environments
• Cadence SiP layout
• AutoCAD
• GDS tools

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